- 品牌：
-
- CUI Devices (4)
- Sunon Fans (1)
- Wakefield-Vette (18)
- Material：
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- Width：
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- Length：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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36 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
3,523
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
2,183
In-stock
|
提交询价 | ||
|
|
Sunon Fans | HEATSINK 27X27X18MM... |
1 |
165
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 19X18MM F... |
1 |
281
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA 35X35... |
1 |
1,232
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
2,491
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,318
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,500
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
6,151
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
998
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
4,137
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
1,871
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/O ... |
1 |
1,144
In-stock
|
提交询价 | ||
|
|
Seeed Technology Co., Ltd | ALUMINUM HEATSIN... |
1 |
401
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
432
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
373
In-stock
|
提交询价 | ||
|
|
Seeed Technology Co., Ltd | ALUMINUM HEATSIN... |
1 |
62
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X18MM F... |
1 |
99
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X18MM S... |
1 |
99
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X18MM D... |
1 |
97
In-stock
|
提交询价 |
