- 品牌：
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- CUI Devices (1)
- Wakefield-Vette (3)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,318
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
1,871
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
373
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 27X18MM S... |
1 |
86
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 27X18MM F... |
1 |
76
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 27X18MM D... |
1 |
17
In-stock
|
提交询价 |
