- 品牌：
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- CUI Devices (2)
- Wakefield-Vette (3)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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5 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
432
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
373
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 23X18MM F... |
1 |
86
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 23X18MM D... |
1 |
85
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 23X18MM S... |
1 |
1
In-stock
|
提交询价 |
