- 品牌:
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- Molex (2)
- Comair Rotron (49)
- CUI Devices (3)
- Ohmite (15)
- Sunon Fans (3)
- t-Global Technology (61)
- Wakefield-Vette (31)
- WEC (7)
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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417 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Ohmite | HEATSINK DUAL FO... |
1 |
175
In-stock
|
提交询价 | |||
Delta Electronics | FAN CPU COOLER 90X... |
1 |
279
In-stock
|
提交询价 | |||
TE Connectivity AMP Connectors | HTS389-P=HS ASSY PP... |
1 |
249
In-stock
|
提交询价 | |||
TE Connectivity AMP Connectors | HEAT SINK BGA 25MM... |
1 |
232
In-stock
|
提交询价 | |||
t-Global Technology | PH3N NANO 50.8X12.70X... |
1 |
311
In-stock
|
提交询价 | |||
Comair Rotron | HEATSINK STAMP 10... |
1 |
347
In-stock
|
提交询价 | |||
TE Connectivity AMP Connectors | HEATSINK ASSEMBL... |
1 |
25
In-stock
|
提交询价 | |||
Ohmite | HEATSINK BLACK A... |
1 |
350
In-stock
|
提交询价 | |||
t-Global Technology | XL25 CERAMIC BOAR... |
1 |
1,845
In-stock
|
提交询价 | |||
Comair Rotron | HEATSINK STAMP 10... |
1 |
937
In-stock
|
提交询价 | |||
t-Global Technology | CERAMIC HEAT SPR... |
1 |
76
In-stock
|
提交询价 | |||
t-Global Technology | CERAMIC HEAT SPR... |
1 |
61
In-stock
|
提交询价 | |||
t-Global Technology | XL25 CERAMIC BOAR... |
1 |
127
In-stock
|
提交询价 | |||
t-Global Technology | CERAMIC HEAT SPR... |
1 |
72
In-stock
|
提交询价 | |||
Wakefield-Vette | HEATSINK FOR STU... |
1 |
227
In-stock
|
提交询价 | |||
t-Global Technology | CERAMIC HEAT SPR... |
1 |
32
In-stock
|
提交询价 | |||
t-Global Technology | CERAMIC HEAT SPR... |
1 |
89
In-stock
|
提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 1W H... |
1 |
625
In-stock
|
提交询价 | |||
Ohmite | HEATSINK DUAL FO... |
1 |
58
In-stock
|
提交询价 | |||
Ohmite | HEATSINK UNIVERS... |
1 |
39
In-stock
|
提交询价 |