- 品牌：
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- Comair Rotron (41)
- CUI Devices (3)
- Ohmite (7)
- Wakefield-Vette (28)
- WEC (6)
- Shape：
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- Width：
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- Length：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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257 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK DUAL FO... |
1 |
175
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | HTS389-P=HS ASSY PP... |
1 |
249
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 25MM... |
1 |
232
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 10... |
1 |
347
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK BLACK A... |
1 |
350
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 10... |
1 |
937
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK FOR STU... |
1 |
227
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 1W H... |
1 |
625
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK UNIVERS... |
1 |
39
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | MAXIGRIP FANSINK... |
1 |
3
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 37.5M... |
1 |
8
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 36... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK EXTRUD ... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 10... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
1 |
50,000
In-stock
|
提交询价 |
