- 品牌：
-
- Comair Rotron (1)
- CUI Devices (1)
- Wakefield-Vette (1)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 26... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK TO-220 W/P... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
1 |
50,000
In-stock
|
提交询价 |
