- Product Status：
-
- Shape：
-
- Width：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- 已选条件：
167 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,361
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,170
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
4
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
1,935
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,205
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,974
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,166
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
1 |
803
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
998
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,540
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,440
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
提交询价 |
