HSB02-101007
请求报价（RFQ）
- * 电子邮件:
- * 零件名称:
- * 数量（pcs）:
- * 验证码:
-
- 制造商 :
- CUI Devices
- 产品分类 :
- 热 - 散热器
- Attachment Method :
- Adhesive
- Diameter :
- -
- Fin Height :
- 0.275" (7.00mm)
- Length :
- 0.394" (10.00mm)
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Power Dissipation @ Temperature Rise :
- 2.0W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 16.50°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 37.90°C/W
- Type :
- Top Mount
- Width :
- 0.394" (10.00mm)
- 数据列表
- HSB02-101007
