- 品牌：
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- CUI Devices (1)
- Material：
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- Width：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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7 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ANOD AL... |
1 |
41,385
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
577
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,170
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 61MM X 58... |
1 |
293
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 61MMX58.2... |
1 |
25
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
提交询价 |
