- 品牌：
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- CUI Devices (1)
- iWave Systems (2)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
iWave Systems | ZU+ MPSOC SOM MOD... |
1 |
10
In-stock
|
提交询价 | ||
|
|
iWave Systems | ARRIA10 SOC SOM HE... |
1 |
10
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | PCIE EXTRUSION P... |
1 |
3
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | PCIE EXTRUSION P... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | PCIE EXTRUSION P... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 4.8W... |
1 |
1
In-stock
|
提交询价 |
