- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
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Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
755
In-stock
|
提交询价 | ||
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Aavid, Thermal Division of Boyd Corporation | BGA HEAT SINK |
1 |
4,769
In-stock
|
提交询价 |