374324B60023G

制造商零件编号
374324B60023G
制造商
Aavid, Thermal Division of Boyd Corporation
包装/箱
-
数据表
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描述
BGA HEAT SINK
库存:
有库存

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制造商 :
Aavid, Thermal Division of Boyd Corporation
产品分类 :
热 - 散热器
Attachment Method :
Solder Anchor
Diameter :
-
Fin Height :
0.394" (10.00mm)
Length :
1.063" (27.00mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
BGA, FPGA
Power Dissipation @ Temperature Rise :
1.5W @ 50°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
6.00°C/W @ 500 LFM
Thermal Resistance @ Natural :
30.60°C/W
Type :
Board Level
Width :
1.063" (27.00mm)
数据列表
374324B60023G

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