- 品牌：
-
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
7 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEAT SINK 25MM X 25... |
1 |
107
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,170
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 19MM X 19... |
1 |
392
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
376
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 19MM X 19... |
1 |
518
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 25X25X9.5M... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 19X19X7.5M... |
1 |
50,000
In-stock
|
提交询价 |
