- 品牌：
-
- Cooling Source (2)
- CUI Devices (3)
- Wakefield-Vette (2)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ANOD AL... |
1 |
41,385
In-stock
|
提交询价 | ||
|
|
Cooling Source | 10X10X10MM, T412 |
1 |
759
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,170
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Cooling Source | 10X10X10MM T411 |
1 |
50,000
In-stock
|
提交询价 |
