TS991SNL500T3
请求报价（RFQ）
- * 电子邮件:
- * 零件名称:
- * 数量（pcs）:
- * 验证码:
-
- 制造商 :
- Chip Quik Inc.
- 产品分类 :
- 焊接
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 3
- Process :
- Lead Free
- Product Status :
- Active
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Solder Paste
- Wire Gauge :
- -
- 数据列表
- TS991SNL500T3
