BDN09-3CB

制造商零件编号
BDN09-3CB
制造商
CTS Thermal Management Products
包装/箱
-
数据表
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描述
HEATSINK CPU .91" SQ
库存:
有库存

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制造商 :
CTS Thermal Management Products
产品分类 :
热 - 散热器
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Fin Height :
0.355" (9.02mm)
Length :
0.910" (23.11mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
9.60°C/W @ 400 LFM
Thermal Resistance @ Natural :
26.90°C/W
Type :
Top Mount
Width :
0.910" (23.11mm)
数据列表
BDN09-3CB

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