XCVC1902-2MLIVSVD1760

制造商 :

AMD Xilinx

产品分类 :

嵌入式 - 片上系统 (SoC)

Architecture :

MPU, FPGA

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Flash Size :

-

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

1760-BFBGA, FCBGA

Peripherals :

DDR, DMA, PCIe

Primary Attributes :

Versal™ AI Core FPGA, 1.9M Logic Cells

Product Status :

Active

RAM Size :

256kB

Speed :

600MHz, 1.4GHz

Supplier Device Package :

1760-FCBGA (40x40)