- 品牌：
-
- Würth Elektronik (1)
- Bergquist (9)
- Jones Tech (4)
- Leader Tech Inc. (5)
- Material：
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- Type：
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- Thickness：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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114 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
881
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
58
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
13
In-stock
|
提交询价 | ||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
65
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
7
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
8
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
2
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX UT20300 9" X 9" |
1 |
31
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX UT20325 9" X 9" |
1 |
27
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX UT20250 9" X 9" |
1 |
24
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX UT20300 18" X 18... |
1 |
7
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX UT20400 18" X 18... |
1 |
4
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX UT20200 18" X 18... |
1 |
4
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
26
In-stock
|
提交询价 | ||
|
|
Shiu Li Technology Co., Ltd. | THERMAL PAD, SHEE... |
1 |
24
In-stock
|
提交询价 | ||
|
|
Power Component Sales, LLC | Polyimide Supported Silicon... |
1 |
14
In-stock
|
提交询价 | ||
|
|
Shiu Li Technology Co., Ltd. | THERMAL PAD, SHEE... |
1 |
11
In-stock
|
提交询价 | ||
|
|
Shiu Li Technology Co., Ltd. | THERMAL PAD, SHEE... |
1 |
24
In-stock
|
提交询价 | ||
|
|
Shiu Li Technology Co., Ltd. | THERMAL PAD, SHEE... |
1 |
10
In-stock
|
提交询价 |
