- 品牌:
-
- Bergquist (6)
- Parker Chomerics (1)
- Product Status:
-
- Material:
-
- Shape:
-
- Usage:
-
- Thermal Conductivity:
-
- Outline:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
31 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
83
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
105
In-stock
|
提交询价 | |||
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
46
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
563
In-stock
|
提交询价 | |||
Bergquist | GAP PAD 8X16" SHEET... |
1 |
28
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Bergquist | GAP PAD 8X8" SHEET... |
1 |
1
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX SF880 |
1 |
3
In-stock
|
提交询价 | |||
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
5
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX B280 18X18IN |
1 |
6
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP G569 9X... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX HD92000,DC1 |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Bergquist | TGP10000ULM-0.080-02-080... |
1 |
50,000
In-stock
|
提交询价 | |||
Bergquist | TGP12000ULM-0.080-00-080... |
1 |
50,000
In-stock
|
提交询价 |