- 品牌:
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- Bergquist (3)
- Parker Chomerics (4)
- Product Status:
-
- Material:
-
- Color:
-
- Thermal Conductivity:
-
- Outline:
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- Backing, Carrier:
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- Thermal Resistivity:
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63 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Laird Technologies - Thermal Materials | THERM PAD 228.6X228.6... |
1 |
432
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP G579 9X... |
1 |
146
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
83
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
105
In-stock
|
提交询价 | |||
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
46
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
563
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP A579 9X... |
1 |
40
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
5
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
13
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX HD380 DC1 18X1... |
1 |
2
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
60
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
15
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Bergquist | GAP PAD 8X8" SHEET... |
1 |
1
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP HCS10G... |
1 |
25
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX SF880 |
1 |
3
In-stock
|
提交询价 | |||
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
5
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX B280 18X18IN |
1 |
6
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
提交询价 |