- 品牌:
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- Bergquist (5)
- Parker Chomerics (1)
- Product Status:
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- Material:
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- Shape:
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- Thermal Conductivity:
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- Outline:
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- Backing, Carrier:
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- Thermal Resistivity:
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27 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
107
In-stock
|
提交询价 | |||
Bergquist | GAP PAD 8X8" SHEET... |
1 |
7
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP G569 9X... |
1 |
6
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX SF8100 |
1 |
3
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TGON 9100 100UM 180X220... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX B2100 18X18IN |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX HD92500,DC1 |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX RB3100,18X18IN... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Bergquist | TGP12000ULM-0.100-00-080... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | COOLZORB-500 |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
170
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX B2100 9X9IN |
1 |
49
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX RB3100,9X9IN, |
1 |
21
In-stock
|
提交询价 | |||
Bergquist | GAP PAD 8X16" SHEET... |
1 |
50,000
In-stock
|
提交询价 | |||
Bergquist | TGP10000ULM-0.100-02-080... |
1 |
50,000
In-stock
|
提交询价 |