- 品牌:
-
- Bergquist (3)
- Parker Chomerics (4)
- Product Status:
-
- Material:
-
- Color:
-
- Thermal Conductivity:
-
- Outline:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
56 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Laird Technologies - Thermal Materials | THERM PAD 228.6X228.6... |
1 |
507
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP G579 9X... |
1 |
81
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP A579 9X... |
1 |
69
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
107
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
426
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX HD82500 9" X 9" |
1 |
39
In-stock
|
提交询价 | |||
Bergquist | GAP PAD 8X8" SHEET... |
1 |
7
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
2
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP G569 9X... |
1 |
6
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
2
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
2
In-stock
|
提交询价 | |||
Parker Chomerics | THERM-A-GAP HCS10G... |
1 |
8
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX SF8100 |
1 |
3
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX P1100 |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 |