- 品牌:
-
- Bergquist (1)
- Material:
-
- Shape:
-
- Thermal Conductivity:
-
- Outline:
-
- Backing, Carrier:
-
7 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Bergquist | THERM PAD 406.4MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX P140 |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 406.4MMX4... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TPLI 240 GAP FILLE... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX P140 |
1 |
133
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 |