- Product Status:
-
- Thermal Conductivity:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
559
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
1
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX HD3160 GAP FI... |
1 |
50,000
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX HD3160 DC1 18X... |
1 |
1
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 |