- 品牌：
-
- Bergquist (10)
- Parker Chomerics (4)
- Product Status：
-
- Material：
-
- Color：
-
- Shape：
-
- Thermal Conductivity：
-
- Outline：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Bergquist | THERM PAD 406.4MMX2... |
1 |
168
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6X228.6... |
1 |
507
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | THERM-A-GAP G579 9X... |
1 |
81
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | THERM-A-GAP A579 9X... |
1 |
69
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
107
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
426
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX HD82500 9" X 9" |
1 |
39
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
6
In-stock
|
提交询价 | ||
|
|
Bergquist | GAP PAD 8X8" SHEET... |
1 |
7
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
2
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | THERM-A-GAP G569 9X... |
1 |
6
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
2
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
2
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | THERM-A-GAP HCS10G... |
1 |
8
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
3
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX SF8100 |
1 |
3
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX P1100 |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 |
