- 品牌：
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- Bergquist (9)
- CUI Devices (39)
- Parker Chomerics (3)
- Wakefield-Vette (1)
- Product Status：
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- Type：
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- Shape：
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- Thickness：
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- Usage：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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194 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Bergquist | THERM PAD 406.4MMX2... |
1 |
555
In-stock
|
提交询价 | ||
|
|
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
46
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | THERM PAD 14X14MM P... |
1 |
762
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX SF820 |
1 |
105
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
13
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
7
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
8
In-stock
|
提交询价 | ||
|
|
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
5
In-stock
|
提交询价 | ||
|
|
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
5
In-stock
|
提交询价 | ||
|
|
Bergquist | BERGQUIST GAP PA... |
1 |
2
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 15MMX30M... |
1 |
14
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 20MMX20M... |
1 |
13
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 10MMX10M... |
1 |
11
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 50MMX50M... |
1 |
13
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 40MMX40M... |
1 |
29
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 41.25MMX4... |
1 |
7
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 15MMX15M... |
1 |
24
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 30MMX30M... |
1 |
15
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX SF850 |
1 |
2
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX SF860 |
1 |
8
In-stock
|
提交询价 |
