- 品牌：
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- Bergquist (8)
- Leader Tech Inc. (3)
- Parker Chomerics (10)
- t-Global Technology (92)
- Product Status：
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- Material：
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- Thickness：
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- Usage：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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195 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | SILICONE THERMAL... |
1 |
127
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERMAL PAD 250X250... |
1 |
74
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | CHO-THERM T500 8X8" ... |
1 |
36
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | CHO-THERM T500 8X8" ... |
1 |
27
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD A1250 10X1... |
1 |
3,772
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD A1250 15X1... |
1 |
1,949
In-stock
|
提交询价 | ||
|
|
Bergquist | THERM PAD 19.05MMX1... |
1 |
4,479
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD A1250 15X1... |
1 |
1,202
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERMAL PAD 25X25M... |
1 |
141
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERMAL PAD 30X30M... |
1 |
185
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
16
In-stock
|
提交询价 | ||
|
|
t-Global Technology | SILICONE THERMAL... |
1 |
52
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
426
In-stock
|
提交询价 | ||
|
|
t-Global Technology | SILICONE THERMAL... |
1 |
187
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX HD3180 GAP FI... |
1 |
2
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | CHO-THERM T500 TO-3... |
1 |
237
In-stock
|
提交询价 | ||
|
|
Bergquist | THERM PAD 45.21MMX3... |
1 |
2,986
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERMAL PAD 10X10M... |
1 |
981
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD A1250 30X3... |
1 |
223
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD A1250 40X4... |
1 |
164
In-stock
|
提交询价 |
