Backing, Carrier:
Thermal Resistivity:
图片 型号 品牌 描述 起订量 库存 操作
57GF3050050C000100 Laird Technologies EMI
THERMALLY CONDUC...
1
RFQ
142
In-stock
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2191990 Bergquist
HI FLOW THF 500
1
RFQ
24,950
In-stock
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2190993 Bergquist
SP400-0.009-AC CUT TO...
1
RFQ
4,700
In-stock
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OTH-Q266182A-00-DN Laird Technologies - Thermal Materials
TFLEX HD82250 32X25MM...
1
RFQ
1,536
In-stock
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8861-9105-742 Laird Technologies EMI
RECSTRSD,ECE072
1
RFQ
196
In-stock
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HSP-8 Sensata-Crydom
THERMAL PAD FOR P...
1
RFQ
59
In-stock
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TO202-MICA NTE Electronics, Inc
MICA FOR TO-202 CAS...
1
RFQ
292
In-stock
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DC0001/06-TG-AH486-2.0-0 t-Global Technology
TG-AH486
1
RFQ
100
In-stock
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DC0001/14-TG-AH486-2.0-0 t-Global Technology
TG-AH486
1
RFQ
100
In-stock
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57GF3127097C000100 Laird Technologies EMI
THERMALLY CONDUC...
1
RFQ
90
In-stock
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57GF3030026C000100 Laird Technologies EMI
THERMALLY CONDUC...
1
RFQ
198
In-stock
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57GF3030011C000100 Laird Technologies EMI
THERMALLY CONDUC...
1
RFQ
199
In-stock
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2633457 Bergquist
BERGQUIST GAP PA...
1
RFQ
6
In-stock
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2633446 Bergquist
BERGQUIST GAP PA...
1
RFQ
6
In-stock
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2633458 Bergquist
BERGQUIST GAP PA...
1
RFQ
6
In-stock
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2633438 Bergquist
BERGQUIST GAP PA...
1
RFQ
5
In-stock
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TG-A4040-21-21-2.5 t-Global Technology
TG SERIES SHEET 2...
1
RFQ
300
In-stock
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HIFLOW-105-AC-1.8X.74 Bergquist
HI-FLOW 0.74X1.8
1
RFQ
372
In-stock
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56-77-9G Aavid, Thermal Division of Boyd Corporation
INSULATOR
1
RFQ
50,000
In-stock
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188635F00000G Aavid, Thermal Division of Boyd Corporation
HEATSINK
1
RFQ
50,000
In-stock
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