- 品牌：
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- 3M (77)
- 3M (TC) (578)
- Bergquist (102)
- CUI Devices (130)
- Leader Tech Inc. (70)
- Parker Chomerics (55)
- Rathbun (2)
- t-Global Technology (1201)
- Wakefield-Vette (53)
- Material：
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- Thickness：
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- Adhesive：
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- Thermal Conductivity：
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- Backing, Carrier：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
3M (TC) | THERM PAD 4.57MX76.2... |
1 |
4
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 20MMX40M... |
1 |
71
In-stock
|
提交询价 | ||
|
|
Bergquist | THERM PAD 406.4MMX2... |
1 |
18
In-stock
|
提交询价 | ||
|
|
Bergquist | GAP PAD 8X8" SHEET... |
1 |
1
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
4
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
2
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 50MMX50M... |
1 |
66
In-stock
|
提交询价 | ||
|
|
3M (TC) | THERM PAD 32.92MX12.... |
1 |
8
In-stock
|
提交询价 | ||
|
|
3M (TC) | 3M THERMALLY COND... |
1 |
2
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX HD83500 9" X 9" |
1 |
4
In-stock
|
提交询价 | ||
|
|
Taica North America Corporation | THERMAL INTERFAC... |
1 |
2
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 40MMX40M... |
1 |
64
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
5
In-stock
|
提交询价 | ||
|
|
Bergquist | GAP PAD 8X8" SHEET... |
1 |
4
In-stock
|
提交询价 | ||
|
|
CUI Devices | THERM PAD 15MMX15M... |
1 |
31
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD 300MMX300... |
1 |
2
In-stock
|
提交询价 | ||
|
|
3M (TC) | THERM PAD W/ADH W... |
1 |
2
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
2
In-stock
|
提交询价 | ||
|
|
Taica North America Corporation | THERMAL INTERFAC... |
1 |
11
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
4
In-stock
|
提交询价 |
