- 品牌：
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- 3M (77)
- 3M (TC) (578)
- Bergquist (102)
- CUI Devices (130)
- Leader Tech Inc. (70)
- Parker Chomerics (55)
- Rathbun (2)
- t-Global Technology (1201)
- Wakefield-Vette (53)
- Material：
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- Color：
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- Type：
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- Thickness：
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- Adhesive：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
3M (TC) | THERM PAD 10M X 25.4... |
1 |
22
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
79
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
23
In-stock
|
提交询价 | ||
|
|
3M (TC) | THERM PAD 4.57MX19.0... |
1 |
13
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | THERM PAD 0.768" X 0.... |
1 |
160
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
10
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
39
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | THERM-A-GAP HCS10G... |
1 |
62
In-stock
|
提交询价 | ||
|
|
3M (TC) | 3M THERMALLY COND... |
1 |
48
In-stock
|
提交询价 | ||
|
|
3M | THERM PAD 210MMX155... |
1 |
17
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX SF10,0.50 229X22... |
1 |
33
In-stock
|
提交询价 | ||
|
|
3M (TC) | THERM PAD 4.57MX25.4... |
1 |
40
In-stock
|
提交询价 | ||
|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
32
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
15
In-stock
|
提交询价 | ||
|
|
Parker Chomerics | THERM PAD 152.4X152.4... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Bergquist | THERM PAD 406.4MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Bergquist | THERM PAD 406.4MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Bergquist | THERM PAD 406.4MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | TFLEX HP34,1.50 127X76... |
1 |
50,000
In-stock
|
提交询价 |
