- 品牌:
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- 3M (77)
- 3M (TC) (578)
- Bergquist (102)
- CUI Devices (130)
- Leader Tech Inc. (70)
- Parker Chomerics (55)
- Rathbun (2)
- t-Global Technology (1201)
- Wakefield-Vette (53)
- Material:
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- Color:
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- Type:
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- Thickness:
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- Adhesive:
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- Thermal Conductivity:
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- Outline:
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- Backing, Carrier:
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- Thermal Resistivity:
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图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
t-Global Technology | THERM PAD 640MMX320... |
1 |
3
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
13
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX B2190 18X18IN |
1 |
3
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
5
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
13
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
20
In-stock
|
提交询价 | |||
t-Global Technology | THERM PAD 640MMX320... |
1 |
3
In-stock
|
提交询价 | |||
3M (TC) | THERM PAD 228.6MMX1... |
1 |
17
In-stock
|
提交询价 | |||
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
16
In-stock
|
提交询价 | |||
t-Global Technology | THERM PAD 300MMX300... |
1 |
4
In-stock
|
提交询价 | |||
t-Global Technology | NON-SILICONE THE... |
1 |
4
In-stock
|
提交询价 | |||
Bergquist | GAP PAD 8X8" SHEET... |
1 |
8
In-stock
|
提交询价 | |||
Taica North America Corporation | THERMAL INTERFAC... |
1 |
5
In-stock
|
提交询价 | |||
Parker Chomerics | THERMATTACH T411 6... |
1 |
74
In-stock
|
提交询价 | |||
Taica North America Corporation | THERMAL INTERFAC... |
1 |
18
In-stock
|
提交询价 | |||
t-Global Technology | THERM PAD 320MMX320... |
1 |
9
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
2
In-stock
|
提交询价 | |||
Laird Technologies - Thermal Materials | TFLEX HD81500 9" X 9" |
1 |
6
In-stock
|
提交询价 | |||
Bergquist | GAP PAD 8X8" SHEET... |
1 |
24
In-stock
|
提交询价 | |||
t-Global Technology | THERM PAD 150MMX150... |
1 |
3
In-stock
|
提交询价 |