- 品牌：
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- Bergquist (16)
- Parker Chomerics (8)
- Material：
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- Shape：
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- Thickness：
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- Thermal Conductivity：
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- Backing, Carrier：
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69 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Bergquist | TGP12000ULM-0.040-00-080... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Laird Technologies - Thermal Materials | GAP FILLER TPLI 2... |
1 |
50,000
In-stock
|
提交询价 |
