- Product Status：
-
- Shape：
-
- Width：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- 已选条件：
167 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.7W... |
1 |
3,033
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
21,545
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 6.8W... |
1 |
2,477
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
1,636
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,908
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
2,183
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
1,105
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
1,798
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
1 |
3,716
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
2,151
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,967
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,708
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
439
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,909
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,219
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
4,992
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,725
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
996
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,988
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,923
In-stock
|
提交询价 |
