- 品牌：
-
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Attachment Method：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
1 |
2,257
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | HEAT SINK COPPER... |
1 |
19,441
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
1 |
14,370
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | HEAT SINK COPPER... |
1 |
5,362
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,967
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 26... |
1 |
50,000
In-stock
|
提交询价 |
