- 品牌：
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- CUI Devices (3)
- Wakefield-Vette (1)
- Product Status：
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- Material：
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- Width：
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- Length：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HTSK-AL-PF750 REV A... |
1 |
703
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,967
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
439
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,923
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 ST... |
1 |
751
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK DPAK SM... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
50,000
In-stock
|
提交询价 |
