- 品牌：
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- CUI Devices (1)
- Ohmite (3)
- Product Status：
-
- Material：
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- Width：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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6 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
218
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1 |
2,179
In-stock
|
提交询价 | ||
|
|
CTS Thermal Management Products | HEATSINK PWR DUA... |
1 |
1,931
In-stock
|
提交询价 | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
1
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
50,000
In-stock
|
提交询价 |
