- 品牌：
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- Ohmite (1)
- Wakefield-Vette (1)
- Material：
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- Type：
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- Width：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
825
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,143
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 H31.7... |
1 |
559
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
8
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK POWER T... |
1 |
499
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
273
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 |
