- 品牌：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEAT SINK 23MM X 23... |
1 |
495
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 17MM X 17... |
1 |
155
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 23MM X 23... |
1 |
428
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
58
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 23X23X7.5M... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
提交询价 |
