- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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7 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | |||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-202 CL... |
1 |
50,000
In-stock
|
提交询价 |