- 品牌：
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- Cooling Source (1)
- CUI Devices (2)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
2,619
In-stock
|
提交询价 | ||
|
|
t-Global Technology | ALUMINIUM HEAT S... |
1 |
182
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Cooling Source | 17X17 95MM WITH INTE... |
1 |
50,000
In-stock
|
提交询价 |
