- 品牌：
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- Wakefield-Vette (2)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,459
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
4,137
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 19X19X23MM... |
1 |
292
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 31X31X12MM... |
1 |
50,000
In-stock
|
提交询价 |
