- 品牌：
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- CUI Devices (1)
- Wakefield-Vette (3)
- Material：
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- Width：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK 31X23MM S... |
1 |
98
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 31X23MM F... |
1 |
56
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | MAXIGRIP FANSINK... |
1 |
84
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 31X23MM D... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
提交询价 |
