- 品牌：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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5 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
84
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
1,871
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,440
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 32.5X32.5X1... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 32.5 X 32.5... |
1 |
12
In-stock
|
提交询价 |
