- 品牌：
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- Cooling Source (7)
- CUI Devices (2)
- Sunon Fans (1)
- Wakefield-Vette (34)
- Material：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | MAXIGRIP FANSINK... |
1 |
323
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | MAXIGRIP FANSINK... |
1 |
840
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA 35X35... |
1 |
1,232
In-stock
|
提交询价 | ||
|
|
Cooling Source | 35X35X10MM, T411 |
1 |
312
In-stock
|
提交询价 | ||
|
|
Cooling Source | 35X35X20MM |
1 |
676
In-stock
|
提交询价 | ||
|
|
Cooling Source | 35X35X20MM, T412 |
1 |
620
In-stock
|
提交询价 | ||
|
|
Cooling Source | 35X35X10MM |
1 |
653
In-stock
|
提交询价 | ||
|
|
Cooling Source | 35X35X20MM, T411 |
1 |
264
In-stock
|
提交询价 | ||
|
|
Cooling Source | 35X35X20MM, INTERFA... |
1 |
320
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
2,491
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA 35X35... |
1 |
1,404
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 35X35X23MM... |
1 |
73
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 35MM X 35... |
1 |
54
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
577
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,380
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,500
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,459
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 35MM X 35... |
1 |
38
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,166
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/O ... |
1 |
1,144
In-stock
|
提交询价 |
