- 品牌：
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- CUI Devices (2)
- Material：
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- Width：
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- Length：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK TO-220 36.8... |
1 |
6,008
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 6.8W... |
1 |
2,477
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc | HEAT SINK FOR TO-... |
1 |
306
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | 62200 EXTRUSION 0.85X... |
1 |
18
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 PW... |
1 |
630
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 PW... |
1 |
32
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
1 |
50,000
In-stock
|
提交询价 |
