- 品牌：
-
- CUI Devices (1)
- Ohmite (4)
- Wakefield-Vette (2)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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14 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
5,682
In-stock
|
提交询价 | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
820
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
1 |
681
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
1 |
146
In-stock
|
提交询价 | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
53
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-202 CL... |
1 |
50,000
In-stock
|
提交询价 |
