- 品牌:
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- Material:
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- Attachment Method:
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- Package Cooled:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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4 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
![]() |
Seeed Technology Co., Ltd | RASPBERRY PI COO... |
1 |
126
In-stock
|
提交询价 | ||
![]() |
Advanced Thermal Solutions Inc. | HEAT SINK 56MM X 56... |
1 |
91
In-stock
|
提交询价 | ||
![]() |
Advanced Thermal Solutions Inc. | HEAT SINK 56MM X 56... |
1 |
123
In-stock
|
提交询价 | ||
![]() |
Enclustra FPGA Solutions | ACC HEATSINK ME A... |
1 |
50,000
In-stock
|
提交询价 |