- 品牌:
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- CUI Devices (1)
- Material:
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- Attachment Method:
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- Package Cooled:
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3 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
56,661
In-stock
|
提交询价 | |||
NTE Electronics, Inc | HEAT SINK FOR SSR |
1 |
41
In-stock
|
提交询价 | |||
CUI Devices | HEAT SINK, BGA, 8.5... |
1 |
50,000
In-stock
|
提交询价 |