- 品牌：
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- CUI Devices (2)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | ALUMINIUM HEAT S... |
1 |
63
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | 78075 EXTRUSION 2.13X... |
1 |
13
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Seeed Technology Co., Ltd | ALUMINUM HEATSIN... |
1 |
401
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
t-Global Technology | ALUMINIUM HEAT S... |
1 |
89
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | CHIPSET HEATSINK... |
1 |
50,000
In-stock
|
提交询价 |
