- 品牌：
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- DFRobot (3)
- iBASE Technology (26)
- WEC (12)
- Product Status：
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- Shape：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- 已选条件：
360 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
TE Connectivity AMP Connectors | HTS389-P=HS ASSY PP... |
1 |
249
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 2W B... |
1 |
347
In-stock
|
提交询价 | ||
|
|
OSEPP Electronics LTD | RASPBERRY PI LOW... |
1 |
43
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc | HEAT SINK FOR TO-... |
1 |
306
In-stock
|
提交询价 | ||
|
|
DFRobot | BLACK ALUMINUM H... |
1 |
481
In-stock
|
提交询价 | ||
|
|
OSEPP Electronics LTD | RASPBERRY PI TAL... |
1 |
211
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc | HEAT SINK-TO-5 TRA... |
1 |
234
In-stock
|
提交询价 | ||
|
|
Trenz Electronic GmbH | HEATSINK FOR TE07... |
1 |
20
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 BLA... |
1 |
3,127
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK TO-18 1W ... |
1 |
1,085
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 1.25W... |
1 |
1,128
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc | HEAT SINK-TO-18 TR... |
1 |
5
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 .4" B... |
1 |
814
In-stock
|
提交询价 | ||
|
|
DFRobot | RASPBERRYPISING... |
1 |
14
In-stock
|
提交询价 | ||
|
|
DFRobot | RASPBERRYPIDUAL... |
1 |
76
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc | HEAT SINK-TO-5 TRA... |
1 |
17
In-stock
|
提交询价 | ||
|
|
Trenz Electronic GmbH | HEATSINK FOR TE07... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Seeed Technology Co., Ltd | ARMOR LITE HEAT S... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Trenz Electronic GmbH | HEATSINK FOR TE07... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
iBASE Technology | HEATSINK;HSIBR210... |
1 |
1
In-stock
|
提交询价 |
